n-Type BBL:PEI, ink butanol-based – Sigma-Aldrich

Synonyms
Poly(benzimidazobenzophenanthroline) polyethylenimine butanol ink, n-ink-40-1-B

Cas No.
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Application
Our n-type BBL:PEI ink is an butanol-based, eco-friendly and halogen-free precursor for high electron conductive and thermally stable (24 hours at 200 °C or 1 hour at 350 °C in N2) thin films. This product has a fixed solid content of 0.2 wt%. This ratio between BBL:PEI (50 % PEI content) results in the highest conductivity. It enables conductivity of up to 8 S/cm and Seebeck coefficient of at least -60 µV/K. Resistant to prolonged air exposure.

It is compatible with large scale deposition methods, such as spray-coating and inkjet. The BBL:PEI ink can be further diluted for casting thin films in various thickness[1]. BBL:PEI thin films were fabricated by spray-casting in air, followed by annealing at 140 °C for 2 h inside a nitrogen-filled glovebox or under vacuum to produce conducting films. The BBL:PEI ink, when processed, forms a high electron conducting n-type film that can be implemented as conducting layer in solar cells, thermoelectric generators, light-emitting diodes, or logic applications:

• OPV – Charge extracting layer in Organic Solar Cells
• SuperCapacitors – Negatrode in Organic Supercapacitors
• OECT – Active material in Organic Electrochemical Transistors
• OLED – Charge injecting layer in Organic Light Emitting Diodes

Preparation Note

• Always store the ink in dark and at ambient temperature.
• Shake the bottle vigorously to ensure an optimal dispersion of the ink prior to processing (by using ultrasonic bath for instance; 100 to 300 W for 30 min).
• The ink is primarily designed to be spray-casted, with an air-gun or similar spraying methods.
• The films are stable in air up to 2 days before its thermal activation.
• Always proceed with the thermal activation of ink under inert environments (vacuum, N2, Ar, etc.) or if properly encapsulated with an air-stable compound.
• Thermally activated films of our ink films are not affected by chloroform, chlorobenzene, 1,8-diiodooctane, dimethylformamide and dimethyl sulfoxide.